2-1437542-2
¥0.00
CONN IC DIP SOCKET 18POS GOLD
參數(shù)名稱(chēng) | 參數(shù)值 |
---|---|
Product Status | Obsolete |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 18 (2 x 9) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 20.0μin (0.51μm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole, Right Angle, Vertical |
Features | Carrier, Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 20.0μin (0.51μm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Aluminum Alloy |
Operating Temperature | -55°C ~ 125°C |
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